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| Advanced Product Information 1.1 FMS2016 SP4T GaAs Multi-Band GSM Antenna Switch Features: Available in die form Suitable for multi-band GSM/DCS/PCS/EDGE applications Excellent low control voltage performance Excellent harmonic performance under GSM power levels Very high isolation >31dB typ. at 1.8GHz Very low insertion loss Very low control current Functional Schematic V1 ANT V2 RF1 RF2 RF3 RF4 V3 V4 Description and Applications: The FMS2016 is a low loss, high power and linear single pole four throw Gallium Arsenide antenna switch designed for use in mobile handset applications. The die is fabricated using the Filtronic FL05 0.5m switch process technology which offers leading edge performance optimised for switch applications. The FMS2016 is designed for use in dual, tri and quad - band GSM handset antenna switch modules and RF front-end modules. Electrical Specifications: Parameter Tx Insertion Loss (TAMBIENT = 25C,Vcontrol = 0V/2.5V, ZIN = ZOUT = 50) Test Conditions 0.5 - 1.0 GHz 1.0 - 2.0 GHz Min Typ 0.5 0.55 0.5 0.55 32 34 31 -75 -75 -75 -75 <0.3 <1.0 Max Units dB dB dB dB dB dB dB dBc dBc dBc dBc s s Rx Insertion Loss 0.5 - 1.0 GHz 1.0 - 2.0 GHz Return Loss Isolation ANT - RF 2nd Harmonic Level 0.5 - 2.5 GHZ 0.5 - 1.0 GHz 1.0 - 2.0 GHz 1 GHz, Pin = +35 dBm, 100% Duty Cycle 2 GHz, Pin = +33 dBm, 100% Duty Cycle 3rd Harmonic Level 1 GHz, Pin = +35 dBm, 100% Duty Cycle 2 GHz, Pin = +33 dBm, 100% Duty Cycle Switching speed : Trise, Tfall Ton, Toff 10% to 90% RF and 90% to 10% RF 50% control to 90% RF and 50% control to 10% RF Note: External DC blocking capacitors are required on all RF ports (typ: 100pF). All unused ports terminated in 50. 1 Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filcsi.com Website: www.filcs.com Advanced Product Information 1.1 FMS2016 Truth Table: V1 High Low Low Low V2 Low High Low Low V3 Low Low High Low V4 Low Low Low High PATH (ON) RF1-ANT RF2-ANT RF3-ANT RF4-ANT Note: `High' `Low' = +2.5V to +5V = 0V to 0.2V Pad and Die Layout: B A C G F J L K M E I D H Pad A B C D E F G H I J K L M Pad Name RF1 V1 ANT V3 RF3 RF2 V2 V4 RF4 GND1 GND2 GND3 GND4 Description RF input port 1 DC Control line 1 Antenna DC Control line 3 RF input port 3 RF input port 2 DC Control line 2 DC Control line 4 RF input port 4 Ground 1 Ground 2 Ground 3 Ground 4 Pin Coordinates 130, 766 237, 815 613, 783 256, 84 136, 128 1124, 765 1025, 816 985, 81 1080, 130 111, 508 1121, 504 111, 391 1121, 392 Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the bond pad opening. Die Size (m) 1230 x 900 Die Thickness (m) 100 Min. Bond Pad Pitch(m) 96 Min. Bond pad opening (m) 70 x 70 2 Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filcsi.com Website: www.filcs.com Advanced Product Information 1.1 FMS2016 Simulated Performance: Loss 0 -10 0.9 GHz -0.52 dB 1.8 GHz -0.54 dB -20 -30 0.9 GHz -38 dB 1.8 GHz -37 dB -40 0.5 1 1.5 2 Frequency (GHz) 2.5 3 -25 Isolation -28 -32 1.8 GHz -31 dB -36 0.9 GHz -34 dB -40 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3 Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filss.com Website: www.filcs.com Advanced Product Information 1.1 FMS2016 Preferred Assembly Instructions: GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is not metallised and the recommended mounting method is by the use of conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy on to the top face of the die and ideally should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for 1 hour in an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4m diameter gold wire is used. Thermosonic ball bonding is preferred. A nominal stage temperature of 150C and a bonding force of 40g has been shown to give effective results for 25m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique, stage temperature should not be raised above 200C and bond force should not be raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimised especially when making RF or ground connections. Handling Precautions: To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No. 22-A114-B. Further information on ESD control measures can be found in MIL-STD-1686 and MILHDBK-263. Disclaimers: This product is not designed for use in any space based or life sustaining/supporting equipment. 4 Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filss.com Website: www.filcs.com |
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